Japanese American Leadership Delegation to Japan

2026/8/4
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2027 JAPANESE AMERICAN LEADERSHIP DELEGATION TO JAPAN
24th DELEGATION (February 6 - February 13, 2027)
 

The Japanese American Leadership Delegation (JALD) program provides the opportunity for a select group of Japanese American leaders from across the U.S. to travel to Japan to engage with Japanese leaders in the business, government, academic, non-profit and cultural sectors. The trip also allows Japanese leaders to gain a greater understanding of multicultural America through the experiences of a diverse group of Japanese Americans. Upon their return, delegates collaborate with JALD alumni, the local consulates, the U.S.-Japan Council (USJC) and local and national community organizations to continue strengthening ties between the U.S. and Japan.

 

The 2027 Delegation will include Japanese Americans who are top leaders in their professions, have had moderate to extensive experience in U.S.-Japan relations, and will be committed to furthering the U.S.-Japan relationship upon their return. The 2027 program seeks senior leaders from a range of sectors, including local, state, regional, or federal government (both appointed and elected officials); philanthropy, nonprofit, and education; technology, AI, and startups; sustainability and energy; and business, finance, and investment. Priority will be given to candidates from areas not represented in previous delegations, with a strong commitment to collaborate with Japanese Americans nationwide. The 2027 Delegation seeks to select a diverse delegation of prominent Japanese American leaders nationally.

 

SUBMISSION OF APPLICATIONS/NOMINATIONS

 

Deadline for receipt of applications: August 17, 2026

  • Applications should be submitted by email to the local consulate office based upon the applicant’s residence (see below for list of consulate offices). For residents of Washington, D.C., Maryland and Virginia, applications should be submitted to the Embassy of Japan.
For more information and to access the application form, please see the following: